Essay Sample on Silicon Run II

Introduction

The silicon run II involves the manufacturing process of silicon after the fabrication of wafers. The testing, packaging, and sorting of the IC wafers into single microchips is also done. The next step involves the assembling of all the devices involved on printed circuit boards found in personal computers and multiple-chip modules of high-end machines (Rahmani, Liljeberg, Hemani, Jantsch, & Tenhunen, 2016). The primary goal of this essay is to write a report on Silicon Run II in the fabrication of all semiconductor chips and ICs.

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The first step is the Integrated Circuit (IC) Review. An IC, also known as chip or microchip in Computer Science, is defined as a semiconductor wafer where the fabrication of millions of components takes place (Hames, Rinne, & Balaraman, 2018). The elements that undergo manufacturing may be active or passive and include diodes, resistors, and transistors, and the activity takes place on a very minute singe silicon chip. The IC fabrication process involves several steps which include lithography, etching, deposition, chemical mechanical polishing, oxidation, ion implantation, and diffusion. These processes mentioned above are not only used in the fabrication of ICs but also in process simulators. These computer tools, therefore, make it possible to create new semiconductor structures and predict their future.

Silicon Run II also involves CAD design. Computer Aided Design is a technology that is used for design and technical documentation through the replacement of manual drafting with automated processes. CAD programs may be either 2D or 3D, for example, AutoCAD and AutoCAD LT software (Rahmani et al., 2016). CAD software has several uses; for example, it is used to enhance and improve communications, and creating databases in the manufacturing process. There are different types of computer-aided designs, but each requires different designs of their manual components. For instance, 3D solids are built by manipulating real-world objects and then forms such as spheres, prisms, and cylinders. The two types of 3D modeling are parametric and direct/explicit modeling.

The multi-chip module (MCM) technology is also used in Silicon Run II. The MCM is an electronic assembly where ICs or chips, semiconductor dies, and other components are integrated. The parts are then unified to form a single element, and they are classified according to the type of technology used in the creation of the HDI substrate. The three kinds of MCMs are laminated, deposited, and a ceramic substrate. There are several MCM technologies which include IBM bubble memory, IBM 3081, Intel Pentium, and Sony memory sticks among others (Hames et al., 2018). The benefits of MCM technologies depends on the installation of an industry-wide manufacturing infrastructure. The technologies used include concurrent design capabilities and substrate layout.

The other area where Silicon Run II is involved is in signal integrity. Signal integrity refers to the challenges that may be encountered in the process of ensuring that all wires carry legit and uncompromised values (Hames et al., 2018). Digital circuits are moved in large parts to ensure that the occurrence of corrupt signals is minimized. Since Moore's law is used to determine the wire scales and transistor sizes, signal security becomes difficult, and noise is produced. There are various sources of noise which include crosstalk between cables, variations in power and ground voltages, and the combination of a gate's output into its input.

Conclusion

In conclusion, Silicon Run II involves the manufacturing process of silicon after the fabrication of wafers. Several steps are involved in the assembling process, but other methods are also involved. Some of these processes include IC fabrication, CAD design, sorting and testing, signal integrity, and multi-chip module technology among others.

References

Hames, G., Rinne, G., & Balaraman, D. (2018). Semiconductor device and method of manufacturing thereof. U.S. Patent Application No. 16/035,231.

Rahmani, A. M., Liljeberg, P., Hemani, A., Jantsch, A., & Tenhunen, H. (2016). The Dark Side of Silicon. Springer, Switzerland.